• 亿邦公众号
    • APP下载

腾讯重仓一个IPO

作者:杨继云 文章来源:投资界

2026-07-15 11:53

作者:杨继云 文章来源:投资界

2026-07-15 11:53

邦小白快读

EN
全文速览

本文核心内容是腾讯重仓的云豹智能创业板IPO申请获深交所受理,冲刺“国产DPU第一股”,核心干货信息整理如下:

1. 项目背景:云豹智能由履历亮眼的斯坦福博士萧启阳2020年在深圳创办,萧启阳曾在硅谷创办芯片公司RMI,后被博通以37亿美元收购,有成功创业经验;云豹切入DPU赛道后不久,英伟达提出三芯战略带火DPU赛道,行业迅速爆发。

2. 股权融资:云豹成立后完成多轮融资,引入多家头部VC、产业资本和政府引导基金,腾讯连续多轮追投,IPO前以19.7792%持股成为第一大股东,公司估值超过140亿元。

3. 产品业绩:云豹自研国内首款400Gbps通用DPU,性能提升4倍、功耗降低50%,2025年营收3.7亿元同比增长超900%,但仍处于亏损状态,当年净亏损11.9亿元。

本文给硬科技领域品牌商提供了赛道选择、资本运作和品牌占位的参考干货,具体内容如下:

1. 产品研发与赛道选择:在国产算力替代的大趋势下,可瞄准细分空白赛道布局,云豹智能在大众关注CPU、GPU时,提前切入DPU赛道,抓住行业风口,快速建立起先发优势,还给产品明确了高性能低功耗的研发方向,贴合市场需求。

2. 资本背书与品牌建设:芯片研发属于高烧钱领域,云豹智能持续引入头部创投、产业资本、地方政府引导基金,获得腾讯重仓加持,既解决了研发资金需求,又获得了强力的产业和资本背书,有效提升品牌认可度。

3. 品牌占位:抓住创业板第四套上市标准的政策窗口,冲刺“国产DPU第一股”的头部品牌占位,借助资本市场放大品牌影响力。

本文给硬科技领域相关从业者整理了政策、机会和风险层面的干货,具体如下:

1. 政策解读:当前创业板针对硬科技企业推出第四套上市标准,不再要求短期净利润,更看重研发投入和市值,为未盈利硬科技企业打开了上市通道;自2024年9月以来创业板指累计上涨约150%,是当前A股表现最突出的主线,市场认可度高。

2. 市场机会:DPU已经成为算力领域“三芯”之一,是千亿级增长赛道,国产替代需求强烈,目前赛道仍处于发展早期,有充足的市场机会,大湾区正在形成半导体资本化梯队,产业红利明显。

3. 风险提示:云豹智能腾讯作为第一大股东,未来增减持可能影响公司控制权稳定;芯片研发投入大,企业长期处于亏损状态,需要警惕持续烧钱的经营风险。

本文给半导体相关工厂提供了产品方向、商业机会和发展层面的干货,具体如下:

1. 产品生产需求:当前DPU赛道爆发,市场对国产高性能低功耗DPU需求迫切,云豹智能量产的产品实现400Gbps带宽,性能提升4倍、功耗降低50%,符合市场需求方向,给芯片制造、封测等工厂指明了高端产品的生产研发方向。

2. 商业机会:当前大湾区半导体产业已经形成清晰的资本化梯队,粤芯半导体代表晶圆制造突破,云豹智能代表高端芯片设计突围,上下游分工明确,给国内晶圆制造、配套零部件生产等工厂带来了大量配套订单机会。

3. 发展启示:当前国产芯片赛道获得政策和资本的双重支持,工厂可抓住国产替代风口,对接芯片设计企业和资本,推进技术升级,参与高端芯片产业链分工,享受产业发展红利。

本文给半导体相关服务商提供了行业趋势、客户需求层面的干货,具体如下:

1. 行业发展趋势:AI算力大爆发带动DPU赛道快速崛起,行业已经形成“CPU+GPU+DPU”三芯并立的共识,DPU成为千亿级热门赛道,国产替代需求迫切,目前国内企业已经冲刺“国产DPU第一股”,赛道进入高速发展期,整体产业机会大。

2. 新技术动向:云豹智能已经完成国内首款高性能通用可编程DPU SoC芯片的量产,采用6nm工艺,可提供弹性网络存储、虚拟化、安全低时延等一站式解决方案,指明了DPU领域的技术发展方向。

3. 客户痛点与商机:芯片创业需要持续大量的资金投入,从研发到上市需要对接创投、产业资源、政策支持等多类服务,给创投服务、产业孵化、财务法律服务等服务商带来了大量的客户需求,可聚焦硬科技芯片赛道布局。

本文给资本市场平台、产业招商平台等平台商提供了需求、运营和风险层面的干货,具体如下:

1. 企业需求:大量优质未盈利硬科技企业有迫切的资本化需求,传统上市标准对未盈利企业限制较多,企业需要更包容、更适配硬科技特征的资本化平台支持。

2. 平台最新实践:创业板推出第四套上市标准,适配未盈利硬科技企业的发展特征,已经吸引云豹智能等大量优质硬科技项目申报,目前创业板已经成为国内硬科技企业最密集的资本市场平台,市场吸引力强。

3. 运营与风险规避:大湾区硬科技资源丰富,半导体已经形成资本化梯队,平台可针对性加大优质硬科技项目的招商布局;同时需要警惕未盈利硬科技企业的持续亏损风险,以及头部大股东持股带来的控制权不稳定风险,做好相应的风险管控。

本文给产业研究者提供了国产半导体产业的最新动向、政策启示和待研究问题,干货整理如下:

1. 产业新动向:AI算力爆发带动DPU成为千亿级热门赛道,国产替代进程加速,大湾区半导体产业已经形成清晰的资本化梯队,广州粤芯代表晶圆制造领域突破,深圳云豹代表高端芯片设计领域突围,补上了深圳底层核心芯片产业的空白,改变了深圳半导体过去集中在消费电子制造的产业格局。

2. 政策启示:创业板推出差异化上市标准,针对未盈利硬科技企业开放资本化通道,有效激活了硬科技产业的创新发展,为资本市场支持硬核科技国产替代提供了全新的样本,对完善产业政策有重要参考价值。

3. 值得研究的新问题:头部产业资本重仓成为第一大股东带来的控制权稳定性问题,以及芯片企业高研发投入下长期亏损的商业模式可持续性问题,都值得深入研究。

声明:快读内容全程由AI生成,请注意甄别信息。如您发现问题,请发送邮件至 run@ebrun.com 。

我是 品牌商 卖家 工厂 服务商 平台商 研究者 帮我再读一遍。

Quick Summary

This article covers that the ChiNext IPO application of Tencent-backed Cloud Leopard Intelligence (Yunbao Intelligence) has been accepted by the Shenzhen Stock Exchange, as the company vies to become China's first domestic DPU public listing. Key takeaways are as follows:

1. Project background: Founded in 2020 in Shenzhen by Stanford PhD Qi-Yang (Kai) Hsiao, an experienced entrepreneur who previously founded Silicon Valley chip company RMI, which was later acquired by Broadcom for $3.7 billion. Shortly after Cloud Leopard entered the DPU track, NVIDIA introduced its "three core chips" strategy that popularized the DPU sector, triggering rapid industry growth.

2. Equity and financing: After its founding, Cloud Leopard completed multiple rounds of financing, bringing in leading venture capital firms, industrial capital and government guidance funds. Tencent participated in successive follow-on investments, becoming the largest shareholder with a 19.7792% stake pre-IPO, valuing the company at over 14 billion yuan.

3. Products and performance: Cloud Leopard's self-developed 400Gbps general-purpose DPU is the first of its kind in China, delivering 4x higher performance with 50% lower power consumption. Its revenue hit 370 million yuan in 2025, representing year-on-year growth of over 900%, but the company remains unprofitable, with a net loss of 1.19 billion yuan that year.

This article provides actionable insights on track selection, capital operations and brand positioning for hard technology brand owners, as follows:

1. Product R&D and track selection: Against the broader trend of domestic computing power substitution, brands can target under-served niche tracks. When most market attention focused on CPUs and GPUs, Cloud Leopard Intelligence entered the DPU track early, seized the industry windfall, built first-mover advantage quickly, and focused its R&D on high performance and low power consumption, which aligns perfectly with market demand.

2. Capital endorsement and brand building: Chip development is extremely capital-intensive. Cloud Leopard continuously brought in leading VC firms, industrial capital and local government guidance funds, and secured a major backing from Tencent. This not only covered R&D funding needs, but also delivered strong industrial and capital endorsement, effectively boosting brand recognition.

3. Brand positioning: By leveraging the policy window of ChiNext's Fourth Listing Standard, Cloud Leopard is vying for the leading brand position of "China's first domestic DPU stock", using capital markets to amplify its brand influence.

This article summarizes key takeaways on policy, opportunities and risks for hard technology industry practitioners, as follows:

1. Policy analysis: ChiNext has launched the Fourth Listing Standard specifically for hard technology firms, which removes short-term net profit requirements and prioritizes R&D investment and market capitalization, opening an exit channel for unprofitable hard technology companies. Since September 2024, the ChiNext Index has rallied roughly 150%, making it the best-performing major segment on the A-share market with high market recognition.

2. Market opportunities: DPU has become one of the three core chips in the computing power sector, representing a trillion-yuan growth track with strong demand for domestic substitution. The track is still in an early development stage with abundant market opportunities. The Greater Bay Area is building a structured semiconductor capitalization ecosystem, offering significant industrial dividends.

3. Risk warnings: With Tencent as Cloud Leopard's largest shareholder, future shareholding increases or reductions may affect the stability of the company's control. Chip development requires massive ongoing investment, leaving companies in long-term losses, so operators need to be alert to the operational risk of sustained cash burn.

This article provides insights on product direction, business opportunities and development for semiconductor-related manufacturing facilities, as follows:

1. Product manufacturing demand: The DPU track is currently booming, with urgent market demand for high-performance, low-power domestic DPUs. Cloud Leopard's mass-produced 400Gbps DPU delivers 4x higher performance and 50% lower power consumption, matching market demand direction, and points the way for chip manufacturing and packaging/testing facilities to develop and produce high-end products.

2. Business opportunities: The Greater Bay Area's semiconductor industry has formed a clear capitalization hierarchy: Yuexin Semiconductor represents a breakthrough in wafer manufacturing, while Cloud Leopard Intelligence represents a breakthrough in high-end chip design, with clear division of labor across the upstream and downstream supply chain. This brings extensive supporting order opportunities for domestic wafer manufacturing and supporting component factories.

3. Development takeaways: Domestic chip tracks currently enjoy dual support from policy and capital. Manufacturers can seize the domestic substitution windfall, partner with chip design firms and investors, advance technology upgrades, participate in the division of labor in the high-end chip supply chain, and capture industrial development dividends.

This article shares insights on industry trends and client demand for semiconductor-related service providers, as follows:

1. Industry development trends: The AI computing boom has driven the rapid rise of the DPU sector, where industry has reached a consensus on the "CPU + GPU + DPU" three-core architecture. DPU is now a trillion-yen hot track with urgent demand for domestic substitution, and domestic companies are already vying to become the first listed domestic DPU player, marking the track's entry into a high-growth phase with massive overall industrial opportunities.

2. New technology trends: Cloud Leopard Intelligence has completed mass production of China's first high-performance general-purpose programmable DPU SoC chip, built on a 6nm process. It offers a one-stop solution for elastic network storage, virtualization, secure low-latency operations and more, outlining the technical development direction for the DPU sector.

3. Client pain points and business opportunities: Chip startups require continuous massive capital injection, and need a wide range of services spanning venture capital connections, industrial resource matching, policy support and more from the R&D phase to listing. This creates substantial client demand for venture capital services, industrial incubation, financial and legal services and other providers, which can position themselves to focus on the hard technology chip track.

This article provides insights on demand, operations and risk management for capital market platforms and industrial investment promotion platforms, as follows:

1. Enterprise demand: A large number of high-quality unprofitable hard technology enterprises have urgent capitalization needs. Traditional listing standards impose heavy restrictions on unprofitable firms, so enterprises need more inclusive capital market platforms better adapted to the characteristics of hard technology.

2. Latest platform practices: ChiNext's Fourth Listing Standard is tailored to the development characteristics of unprofitable hard technology firms, and has already attracted a large number of high-quality hard technology projects including Cloud Leopard Intelligence. ChiNext has now become the capital market platform with the highest concentration of domestic hard technology enterprises, with strong market attractiveness.

3. Operations and risk mitigation: The Greater Bay Area has abundant hard technology resources, and semiconductors have formed a clear capitalization hierarchy. Platforms can step up targeted investment promotion for high-quality hard technology projects. At the same time, they need to guard against the risks of sustained losses among unprofitable hard technology firms and control instability caused by large holdings by top major shareholders, and put in place corresponding risk management measures.

This article summarizes the latest developments, policy implications and open research questions for industry researchers focused on China's domestic semiconductor industry, as follows:

1. New industrial developments: The AI computing boom has turned DPU into a trillion-yuan hot track, accelerating the domestic substitution process. The Greater Bay Area's semiconductor industry has formed a clear capitalization hierarchy: Guangzhou-based Yuexin Semiconductor represents a breakthrough in wafer manufacturing, while Shenzhen-based Cloud Leopard represents a breakthrough in high-end chip design. This fills the gap in Shenzhen's core underlying chip industry, reshaping Shenzhen's semiconductor landscape that was previously concentrated in consumer electronics manufacturing.

2. Policy implications: ChiNext's introduction of differentiated listing standards, which open up capital access for unprofitable hard technology firms, has effectively activated innovation in the hard technology sector. It provides a new case study for how capital markets can support domestic substitution of core hard technology, and offers important reference value for improving industrial policy.

3. New research questions: The issue of control stability caused by leading industrial capital holding a majority stake as the largest shareholder, and the sustainability of the business model of long-term losses driven by high R&D investment for chip companies, both warrant further in-depth research.

Disclaimer: The "Quick Summary" content is entirely generated by AI. Please exercise discretion when interpreting the information. For issues or corrections, please email run@ebrun.com .

I am a Brand Seller Factory Service Provider Marketplace Seller Researcher Read it again.

腾讯是最大股东。

作者/杨继云

报道/投资界PEdaily

深圳超级IPO来了。

日前,深圳云豹智能股份有限公司(简称“云豹智能”)创业板IPO申请正式获深交所受理,成为又一家选用创业板第四套上市标准申报上市的企业,冲刺“国产DPU第一股”。

回想6年前,斯坦福博士萧启阳在深圳创办云豹智能,专注于DPU赛道。这个团队启航两个月后,千亿DPU赛道开始爆发。至今,他背后站着腾讯等一支长长的投资人队伍。

腾讯无疑最为重仓,已成为云豹智能最大股东。与广东国资押注的粤芯半导体一起,云豹智能成为大湾区又一标志性的半导体案例。

斯坦福博士,干出深圳独角兽

快IPO了

先从创始人萧启阳说起。

他出生于中国香港,早年赴美求学,学术履历极为耀眼:以最高荣誉(Summa Cum Laude)同时毕业于纽约大学(数学和计算机科学学士)和纽约库珀大学(电子工程学士),24岁即获得斯坦福大学电子工程博士学位,此后先后在加州大学尔湾分校、麻省理工学院任教。

博士期间,萧启阳主攻人工智能和神经网络方向。他的一项成果曾破解AI领域三十多年未解的理论难题,受到"人工智能之父"Marvin Minsky的高度赞誉并亲自撰写序言。

第一次创业是在2002年,他在硅谷联合创办了芯片公司RMI,后被博通以37亿美元的现金高价并购,震惊业界。

2020年,目睹算力国产替代的机会,萧启阳再次创业。考虑到国内人才和成本优势,这一年8月,他回到深圳创办云豹智能——在很多人还在讨论CPU、GPU的时候,专攻DPU。

说来也巧,不久后,英伟达在GTC大会上正式推出DPU概念,黄仁勋提出"CPU+DPU+GPU"的"三芯"战略,DPU赛道迅速成为"兵家必争之地"。

此后云豹智能快速崛起。自主研发了国内首款高性能、通用可编程DPU SoC芯片,网络带宽达400Gbps,相比传统方案性能提升4倍、功耗降低50%以上。仅用4年时间,就完成了从FPGA验证到6nm SoC量产的全过程。

根据招股书,目前云豹智能能够提供包括弹性网络与存储、虚拟化、安全及低时延RDMA等功能在内的一站式解决方案。

招股书显示,云豹智能2023年、2024年、2025年营收分别为17万、3635万、3.7亿元;净亏损分别为6.67亿、6亿、11.9亿元;扣非后净亏损分别为6.7亿、6.2亿、5.6亿。尽管2025年营收同比增长超900%,云豹智能依然处于亏损状态。

由此,深圳又一个超级IPO浮现。

VC/PE云集

腾讯成最大股东

芯片创业,无疑是烧钱黑洞。

截至递交招股书前,云豹智能也经历了数轮融资。最早是在2020年底,彼时公司刚注册两个月,就一口气拿下五源资本、正心谷资本、中芯聚源、华业天成、耀途资本、弘卓资本等投资机构加持的种子轮融资。

半年后,云豹智能再次完成阵容豪华的天使轮融资,包括红杉中国、深创投、腾讯、五源资本、华业天成、QBN Capital。萧启阳曾在演讲中提到,“创立云豹智能时,我只有一个人,拿到天使轮之后才敢去请创始团队。”

正是在这一轮中,云豹智能迄今最重要的股东出现——腾讯。这是腾讯首次入局,此后连续重注。

2021年9月,云豹智能完成A轮融资,腾讯再次出手数亿元人民币,其它投资方除了红杉中国、深创投、五源资本等老股东外,还包括淡马锡、蔚来资本、正心谷资本、华西村股份旗下投资平台一村资本、民生银行上市金融控股平台民银资本、耀途资本等等。

至此,云豹智能成为国内DPU独角兽。

随后的融资更是势如破竹——2023年拿下阳光保险、国信资本、润信新观象产业基金等的融资,2024年后政府引导基金进场,深圳市引导基金和宝安区产业投资引导基金B轮融资;2025年,IDG资本、杭州产投、杭实资管、萧山资本等三家杭州国资、鹏鼎控股、云尖信息等产业方悉数进场,老股东参与。

2025年11月底,同创伟业、东方富海、基石资本等几家深圳本土VC一举加持,IDG资本、腾讯再度参与其中。此后估值超过140亿元。

IPO前,腾讯通过关联主体以19.7792%的持股成为云豹智能的第一大股东,而公司实际控制人萧启阳、张学利合计直接持有公司7.1520%的股权,通过云豹创芯、云豹创智两个持股平台间接控制公司22.6588%的表决权。

这也提示了一种风险:腾讯作为第一大股东,未来在二级市场增持或减持都可能对公司控制权稳定性产生影响。

创业板窗口

大湾区开启上市潮

终于轮到深圳了。

过去很长一段时间,深圳在半导体领域的标签更多是“消费电子应用”和“终端制造”。在这一轮AI算力大爆发的浪潮中,围绕国产算力的资本竞赛正全面提速,深圳急需一个能代表底层核心技术的超级IPO。

此前国产GPU的IPO浪潮中,摩尔线程、沐曦、壁仞科技等多集中在北京、上海等地,如今云豹智能冲刺“国产DPU第一股”,恰好为深圳在“基础设施芯片”维度补上了一块重要拼图。

由此望去,大湾区半导体资本化正在形成梯队效应。

不久前,粤芯半导体技术股份有限公司(简称“粤芯半导体”)创业板IPO成功过会,拟募资75亿元。对于投资方来说,这同样是一场漫长押注——八年前,粤芯半导体从广州黄埔的一片空地起步,后来成为粤港澳大湾区第一家实现量产的12英寸晶圆制造企业。

一路走来,在这只广州超级独角兽背后,广东国资几乎贯穿其每一轮融资,寄予沉沉的厚望。

看上去,粤芯半导体代表了大湾区在晶圆制造领域的突破,云豹智能则代表了大湾区在高端芯片设计(DPU)领域的突围。

此刻,他们乘着创业板改革红利的东风。

粤芯半导体选择适用创业板第三套上市标准,是继大普微之后,创业板第二家未盈利过会企业;而今年4月创业板正式启用“第四套上市标准”,看重研发投入和市值,而非短期净利润,此后云豹智能IPO顺利推进。他们都向硬科技企业释放信号——只要技术过硬、研发够高、成长性够强,资本市场的大门已经敞开。

创业板开始热闹。自2024年9月以来,创业板指累计上涨约150%,成为A股最醒目的主线之一;放眼望去,创业板已经成为中国硬科技公司最密集的资本市场样本之一。

这当中,大湾区的硬科技军团已经吹响了突围的号角。

注:文/杨继云,文章来源:投资界(公众号ID:pedaily2012),本文为作者独立观点,不代表亿邦动力立场。

【版权提示】亿邦动力倡导尊重与保护知识产权。未经许可,任何人不得复制、转载、或以其他方式使用本网站的内容。如发现本站文章存在版权问题,烦请提供版权疑问、身份证明、版权证明、联系方式等发邮件至run@ebrun.com,我们将及时沟通与处理。

已点赞

+1

{{ praise_text }}

好文章,值得被更多人看到

FAQ回顾

云豹智能是做什么的?

云豹智能2020年由斯坦福博士萧启阳在深圳创办,属于半导体DPU赛道,自主研发国内首款高性能通用可编程DPU SoC芯片,可提供弹性网络与存储、虚拟化、安全及低时延RDMA等一站式解决方案。

云豹智能IPO前第一大股东是谁?

云豹智能IPO前,腾讯通过关联主体持股19.7792%为第一大股东,实际控制人萧启阳、张学利合计直接持股7.152%,通过两个持股平台间接控制22.6588%的表决权,腾讯增减持可能影响公司控制权稳定性。

未盈利的硬科技企业能申报创业板上市吗?

可以,创业板设置了多套上市标准,其中2024年4月启用的第四套上市标准看重研发投入和市值,而非短期净利润,冲刺国产DPU第一股的云豹智能目前仍处亏损状态,适用该标准申报IPO。

大湾区代表性半导体IPO企业有哪些?

大湾区代表性半导体IPO企业包括云豹智能和粤芯半导体,前者主攻DPU高端芯片设计,冲刺国产DPU第一股;后者是大湾区首家实现12英寸晶圆量产的制造企业,已成功通过创业板上市审核。

广告

下一篇

跨境电商资源对接

《全球跨境电商服务商资源手册》第二期手册现已发布,触达更多资源,了解跨境服务商信息,欢迎点击链接下载。

了解详情

安踏CEO徐阳将辞任 原因或为品牌业绩不达预期

安踏品牌CEO徐阳将正式辞任。安踏集团也官方证实,徐阳离职系个人家庭原因,相关辞任申请已获集团正式批准,后续集团将对其另有任用。

品牌故事 运动户外 鞋 服装

2026-07-15 11:50:05